US Patent Issued to QUALCOMM on Dec. 30 for "Substrate with multiple core layers to provide varied thickness cavities supporting varied thickness embedded electrical devices, and related integrated circuit (IC) packages and fabrication methods" (California Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,412, issued on Dec. 30, was assigned to QUALCOMM Inc. (San Diego).

"Substrate with multiple core layers to provide varied thickness cavities supporting varied thickness embedded electrical devices, and related integrated circuit (IC) packages and fabrication methods" was invented by Xia Li (San Diego), John Holmes (Escondido, Calif.), Aniket Patil (San Diego) and Bin Yang (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "Substrate with multiple core layers to provide varied thickness cavities supporting varied thickness embedded electrical devices, and related integrated circuit (IC) packages and fabrication methods. To provide for core laye...