ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,460,844, issued on Nov. 4, was assigned to Parker-Hannifin Corp. (Cleveland).

"Ball seal for thermal sensor assembly of thermostatic expansion valve" was invented by Eric R. Coyle (Chesterfield, Mo.) and Dylan T. Yegge (Washington, Mo.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal sensor assembly for a thermostatic expansion valve includes an enclosure that forms an enclosed interior space containing a thermal sensing fluid, and an opening in the enclosure for charging the thermal sensing fluid. A ball is arranged in the opening and forms a fluid seal between a sealing surface and a sealing interface of the assembly. The sealing surface may be...