US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on Sept. 30 for "Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminated board, and wiring board" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,428,534, issued on Sept. 30, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminated board, and wiring board" was invented by Atsushi Wada (Osaka, Japan), Masashi Koda (Fukushima, Japan), Ryusei Kozawa (Osaka, Japan) and Yuki Kitai (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An aspect of the present invention relates to a resin composition, which contains a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond and a free radical compound, ...