US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on Sept. 2 for "Thermosetting composition, resin sheet, metal foil with resin, metal-clad laminate, and printed wiring board" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,404,389, issued on Sept. 2, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Thermosetting composition, resin sheet, metal foil with resin, metal-clad laminate, and printed wiring board" was invented by Kouichi Aoki (Hyogo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin sheet includes a dried product or semi-cured product of a thermosetting composition, the thermosetting composition including an ethylene-propylene-diene copolymer as Component (A); and an inorganic filler, as Component (B), surface-treated with a surface treatment agent having a polymerizable unsaturated bond."

The patent was filed on Ma...