US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on Oct. 21 for "Metal-clad laminate, wiring board, resin-including metal foil, and resin composition" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,447,719, issued on Oct. 21, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Metal-clad laminate, wiring board, resin-including metal foil, and resin composition" was invented by Akira Irifune (Fukushima, Japan), Shun Yamaguchi (Fukushima, Japan), Fuminori Satou (Fukushima, Japan), Tatsuya Arisawa (Fukushima, Japan) and Mitsuyoshi Nishino (Fukushima, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A metal-clad laminate includes an insulating layer that contains a cured product of a resin composition containing a polymer having a structural unit represented by Formula (1) in a molecule and a metal foil that is lam...