US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on May 27 for "Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board" (Japanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,312,452, issued on May 27, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board" was invented by Atsushi Wada (Osaka, Japan), Masashi Koda (Fukushima, Japan), Ryusei Kozawa (Osaka, Japan) and Yuki Kitai (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An aspect of the present application relates to a resin composition, which contains a polymer having a structural unit represented by Formula (1) in a molecule and a free radical compound and in which the free radical compound has at least one free radical gr...