US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on July 1 for "Resin composition, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,344,738, issued on July 1, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Resin composition, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board" was invented by Kosuke Okuno (Osaka, Japan) and Masaya Koyama (Mie, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition contains a polyphenylene ether compound, a styrene block copolymer, a polybutadiene compound, and a curing agent. The polyphenylene ether compound has, in a molecule thereof, at least one of a group expressed by formula (1) or a group expressed by formula (2). The polybutadiene compound has an epoxy gr...