US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on Aug. 12 for "Resin composition, resin film using same, metal foil with resin, metal-clad laminate, and wiring board" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,384,862, issued on Aug. 12, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Resin composition, resin film using same, metal foil with resin, metal-clad laminate, and wiring board" was invented by Tomohiro Fukao (Osaka, Japan), Tomoaki Sawada (Osaka, Japan) and Kyosuke Michigami (Hyogo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An aspect of the present invention relates to a resin composition containing an acrylic resin and a curing agent, in which the acrylic resin contains a polymerization unit (A) of a (meth)acrylate having an epoxy group, a polymerization unit (B) of a (meth)acrylate having a cyano grou...