US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on April 29 for "Resin composition, prepreg, resin-equipped film, resin- equipped metal foil, metal-clad laminate, and wiring board" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,286,500, issued on April 29, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Resin composition, prepreg, resin-equipped film, resin- equipped metal foil, metal-clad laminate, and wiring board" was invented by Taichi Nakashima (Fukushima, Japan), Hiroyuki Fujisawa (Fukushima, Japan), Akira Otsuka (Fukushima, Japan), Koichi Isaji (Fukushima, Japan) and Hajime Ogushi (Fukushima, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition contains a preliminary reaction product (A) obtained by previously reacting a polyphenylene ether compound (a1) having a hydroxyl group in a molecule and an acid anhydride (...