US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on April 15 for "Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,275,846, issued on April 15, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan).

"Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board" was invented by Jun Yasumoto (Fukushima, Japan), Rihoko Watanabe (Osaka, Japan), Teppei Washio (Fukushima, Japan) and Hiroharu Inoue (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition contains a curable resin. A minimum value (Min) of loss tangent (tan Delta=E"/E') of a cured product of the resin composition is equal to or greater than 0.04. The loss tangent is a ratio of a loss modulus (E") of the c...