US Patent Issued to NIPPON MICROMETAL, NIPPON STEEL Chemical & Material on June 10 for "AI wiring material" (Japanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,325,901, issued on June 10, was assigned to NIPPON MICROMETAL Corp. (Saitama, Japan) and NIPPON STEEL Chemical & Material Co. Ltd. (Tokyo).

"AI wiring material" was invented by Yuto Kurihara (Saitama, Japan), Ryo Oishi (Saitama, Japan), Motoki Eto (Saitama, Japan), Daizo Oda (Saitama, Japan), Tetsuya Oyamada (Tokyo), Yuya Suto (Tokyo) and Tomohiro Uno (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided an Al wiring material which suppresses a chip crack and achieves thermal shock resistance while suppressing lowering of a yield at the time of manufacture. The Al wiring material contains at least Sc and Zr so as to satisfy 0.01less th...