US Patent Issued to NINGBO HALLEY HEAT EXCHANGE EQUIPMENT on April 15 for "Chip cooler with high pressure bearing capacity" (Chinese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,116, issued on April 15, was assigned to NINGBO HALLEY HEAT EXCHANGE EQUIPMENT Co. LTD (Zhejiang, China).

"Chip cooler with high pressure bearing capacity" was invented by Dingjun Dai (Zhejiang, China), Hongqiang Zhuo (Zhejiang, China), Xuguang Sun (Zhejiang, China), Aibin Yan (Zhejiang, China) and Tinghui Chen (Zhejiang, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip cooler with high pressure bearing capacity installed on a chip it cools. The chip cooler has a cooler body having a refrigerant channel formed corresponding to the internal construction of the cooler body and configured to guide the flow of a refrigerant, and two liquid inl...