US Patent Issued to National Cheng Kung University, SanFan Internal investment on Sept. 16 for "Method of manufacturing inorganic binder by reduction furnace slag and cured solid manufactured by the method" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,415,756, issued on Sept. 16, was assigned to National Cheng Kung University (Tainan, Taiwan) and SanFan Internal investment Co. LTD. (Tainan, Taiwan).

"Method of manufacturing inorganic binder by reduction furnace slag and cured solid manufactured by the method" was invented by Jong-Shin Huang (Tainan, Taiwan), Wen-Pi Ko (Tainan, Taiwan) and Ting-Chun Lin (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing inorganic binder by reduction furnace slag includes a raw material preparation step, a stirring step, a maintaining step and a drying step. The raw material preparation step is to provide a powder mixture containi...