US Patent Issued to NANODOCKS TECHNOLOGY, CITY UNIVERSITY OF HONG KONG on Dec. 30 for "Electrospun film, method for manufacturing the same and use of such electrospun film" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,509,799, issued on Dec. 30, was assigned to NANODOCKS TECHNOLOGY Ltd. (Hong Kong) and CITY UNIVERSITY OF HONG KONG (Hong Kong).

"Electrospun film, method for manufacturing the same and use of such electrospun film" was invented by Jinlian Hu (Hong Kong), Shuo Shi (Hong Kong), Yifan Si (Hong Kong), Siu Wah Wong (Hong Kong) and Muk Fung Yuen (Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention provides an enhanced electrospun film made from polyvinylidene fluoride (PVDF) and at least one low-melting-point polymer in a ratio of 99.9:0.1-90:10 by weight, and the low-melting-point polymer having a melting point lower than the polyvinyliden...