US Patent Issued to NANJING UNIVERSITY, JIANGSU HHCK ADVANCED MATERIALS on March 18 for "Metal-resin composite, surface treatment method, and substrate of circuit board for high-frequency and high-speed signal transmission" (Chinese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,251,862, issued on March 18, was assigned to NANJING UNIVERSITY (Nanjing, China) and JIANGSU HHCK ADVANCED MATERIALS Co. LTD. (Lianyungang, China).

"Metal-resin composite, surface treatment method, and substrate of circuit board for high-frequency and high-speed signal transmission" was invented by Wei Chen (Nanjing, China), Qi Xue (Nanjing, China), Huijie Zhuang (Nanjing, China), Linling Li (Nanjing, China), Jianglong Han (Nanjing, China), Dongshan Zhou (Nanjing, China) and Xiaoliang Wang (Nanjing, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A metal-resin composite, a surface treatment method, and a substrate of a printed circuit board (PCB) ...