US Patent Issued to MODULAR POWER TECHNOLOGY on May 20 for "Apparatus for power module and heat dissipation of an integrated circuit" (Texas, California, New Jersey Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,154, issued on May 20, was assigned to MODULAR POWER TECHNOLOGY INC. (Sunnyvale, Calif.).

"Apparatus for power module and heat dissipation of an integrated circuit" was invented by Dhammika L. Perera (San Jose, Calif.), John Weld (Ledgewood, N.J.) and Matthew Wilkowski (Rockwall, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present disclose a power module system including a power module operatively coupled to an integrated circuit die, where the power module includes a band comprising of a high thermally conductive material disposed around an inductor and where the band is at least partially disposed around the inductor."...