US Patent Issued to MITSUBISHI GAS CHEMICAL on Oct. 14 for "Polyimide resin, photosensitive resin composition, resin film, and electronic device" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,441,842, issued on Oct. 14, was assigned to MITSUBISHI GAS CHEMICAL COMPANY INC. (Tokyo).

"Polyimide resin, photosensitive resin composition, resin film, and electronic device" was invented by Daichi Miyahara (Okayama, Japan) and Yumi Sato (Okayama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A modified polyimide resin containing a structure represented by general formula (I) below. A polyimide resin containing: a structural unit A derived from a tetracarboxylic dianhydride; and a structural unit B derived from a diamine compound, wherein the structural unit A contains a structural unit derived from a compound having a specific structure in a p...