US Patent Issued to Mitsubishi Gas Chemical on June 10 for "Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,325,770, issued on June 10, was assigned to Mitsubishi Gas Chemical Co. Inc. (Tokyo).

"Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board" was invented by Yuji Nakashima (Tokyo), Takashi Kobayashi (Tokyo), Shunsuke Hirano (Tokyo) and Keiichi Hasebe (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a resin composition having low dielectric constants and low dielectric loss tangents before moisture absorption (initial state) and after moisture absorption with high metal foil peel strength; and a cured product, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring...