US Patent Issued to Mitsubishi Gas Chemical on Jan. 27 for "Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,617, issued on Jan. 27, was assigned to Mitsubishi Gas Chemical Co. Inc. (Tokyo).

"Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board" was invented by Takashi Kobayashi (Tokyo), Kazuhiro Hashiguchi (Tokyo) and Keiichi Hasebe (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a resin composition having high thermal resistance and low dielectric properties, as well as a cured product, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board. The resin composition contains a compound (A) represented by Formula (M1) and a cyanate ester compound (B) containing ...