ALEXANDRIA, Va., June 6 -- United States Patent no. 12,281,195, issued on April 22, was assigned to MITSUBISHI GAS CHEMICAL COMPANY INC. (Tokyo).
"Epoxy resin composition, gas barrier film, and laminate" was invented by Kazuki Kouno (Kanagawa, Japan) and Ryoma Hashimoto (Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is an epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an acidic compound, wherein a ratio (basic nitrogen/acid groups) of a molar equivalent of basic nitrogen in the epoxy resin composition to a molar equivalent of acid groups derived from the acidic compound is from 0.10 to 3.0. Also provided are ...