US Patent Issued to MITSUBISHI ELECTRIC on Jan. 27 for "Semiconductor package, semiconductor device, and power conversion device" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,820, issued on Jan. 27, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo).

"Semiconductor package, semiconductor device, and power conversion device" was invented by Kozo Harada (Tokyo) and Hodaka Rokubuichi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a semiconductor element, a first insulating layer, a first wiring layer, a second insulating layer, and a second wiring layer. The first insulating layer covers the semiconductor element. The first wiring layer includes a first layer section. The first layer section covers the first insulating layer. The second insulating layer covers the first insulating laye...