US Patent Issued to Mitsubishi Chemical on Feb. 18 for "Mold release film, film laminate, method for producing mold release film, and method for producing film laminate" (Japanese Inventor)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,226,937, issued on Feb. 18, was assigned to Mitsubishi Chemical Corp. (Tokyo).

"Mold release film, film laminate, method for producing mold release film, and method for producing film laminate" was invented by Yosuke Oseki (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A mold release film, including a mold release layer formed by curing a mold release layer composition containing a curable silicone having a fluorine substituent, a curable silicone having no fluorine substituent, and a curing catalyst, on at least one surface of a substrate film. In a concentration distribution of fluorine atoms in a thickness direction within the mold release lay...