US Patent Issued to LG Electronics on Jan. 27 for "Heat exchanger having a plurality of heat dissipation fins" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,259, issued on Jan. 27, was assigned to LG Electronics Inc. (Seoul, South Korea).

"Heat exchanger having a plurality of heat dissipation fins" was invented by Bongjun Kim (Seoul, South Korea), Sehyoun Kim (Seoul, South Korea) and Minwoo Jeong (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat exchanger includes a plurality of refrigerant tubes through which refrigerant can flow; a plurality of collars surrounding at least a portion of an outer surface of each refrigerant tube; a plurality of heat dissipation fins connected to the plurality of collars; and an electrode in contact with each heat dissipation fin to transmit power...