US Patent Issued to Lenovo (Singapore) on Feb. 25 for "Heat dissipation structure, method for manufacturing heat dissipation structure, and electronic apparatus" (Japanese, Chinese Inventors)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,238,897, issued on Feb. 25, was assigned to Lenovo (Singapore) Pte. Ltd. (Singapore).

"Heat dissipation structure, method for manufacturing heat dissipation structure, and electronic apparatus" was invented by Ryota Watanabe (Kanagawa, Japan), Masahiro Kitamura (Kanagawa, Japan), Mizuki Itoyama (Kanagawa, Japan), Takuroh Kamimura (Kanagawa, Japan) and Junrong Zhou (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation structure, for a heat-generating electric component, includes: a heat dissipator disposed along a surface of the electric component; and a porous material held between the electric component and the heat dissipator. The...