ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,773, issued on Oct. 28, was assigned to LAT Enterprises Inc. (Raleigh, N.C.).

"Material for dissipating heat from and/or reducing heat signature of electronic devices and clothing" was invented by Laura Thiel (Raleigh, N.C.) and Carlos Cid (Raleigh, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems, methods and articles having a heat-shielding or blocking, heat-dissipating and/or heat signature-reducing material layer or coating are disclosed. In one example, the heat-shielding or blocking, heat-dissipating and/or heat signature-reducing material completely covers the interior of a housing having a plurality of battery cells removably disp...