US Patent Issued to Kunming University of Science and Technology on Dec. 9 for "Corrosion-resistant Sn-Ag-Cu series lead-free solder alloy" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,491,584, issued on Dec. 9, was assigned to Kunming University of Science and Technology (Kunming, China).

"Corrosion-resistant Sn-Ag-Cu series lead-free solder alloy" was invented by Caiju Li (Yunnan, China), Yingde Miao (Yunnan, China), Zunyan Xu (Yunnan, China), Li Fu (Yunnan, China), Liyuan Liu (Yunnan, China), Jianhong Yi (Yunnan, China), Qiong Lu (Yunnan, China) and Jiangnan Li (Yunnan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a corrosion-resistant Sn-Ag-Cu series lead-free solder alloy, belonging to the technical field of soldering material. The present disclosure provides a Sn-Ag-Cu series lead-free so...