ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,539, issued on Sept. 23, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Local enlarged via-to-backside power rail" was invented by Ruilong Xie (Niskayuna, N.Y.), Albert M. Chu (Nashua, N.H.), Carl Radens (LaGrangeville, N.Y.) and Brent A. Anderson (Jericho, Vt.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure having improved performance is provided that includes a local enlarged via-to-backside power rail (VBPR) contact structure which connects a source/drain region of one field effect transistor (FET) to a backside power rail."

The patent was filed on Sept. 6, 2022, under Application No. 17/903,644....