US Patent Issued to International Business Machines on Oct. 7 for "Damascene interconnect spacer to facilitate gap fill" (New York Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,077, issued on Oct. 7, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Damascene interconnect spacer to facilitate gap fill" was invented by Nicholas Anthony Lanzillo (Wynantskill, N.Y.), Timothy Mathew Philip (Albany, N.Y.) and Kevin W. Brew (Niskayuna, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor component includes a dielectric layer including an opening. The semiconductor component further includes a liner arranged in the opening in direct contact with the dielectric layer. The semiconductor component further includes a wetting layer arranged in the opening in direct contact with the liner. The semicon...