ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,130, issued on Nov. 4, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Wrap around metal via structure" was invented by Reinaldo Vega (Mahopac, N.Y.), Nicholas Anthony Lanzillo (Wynantskill, N.Y.), Albert M. Chu (Nashua, N.H.), Lawrence A. Clevenger (Saratoga Springs, N.Y.), Ruilong Xie (Niskayuna, N.Y.) and Brent A Anderson (Jericho, Vt.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A structure is provided that includes a first metal level including a first metal line, a second metal level spaced apart from the first metal level and including a second metal line, and a first metal via structure connecting the first metal line...