US Patent Issued to International Business Machines on Nov. 4 for "Integrated circuit device with interconnects made of layered topological materials" (Swiss Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,137, issued on Nov. 4, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Integrated circuit device with interconnects made of layered topological materials" was invented by Bogdan Cezar Zota (Rueschlikon, Switzerland), Bernd W. Gotsmann (Horgen, Switzerland), Heinz Schmid (Horgen, Switzerland), Alan Molinari (Kilchberg, Switzerland) and Lorenzo Rocchino (Zurich).

According to the abstract* released by the U.S. Patent & Trademark Office: "Described is an integrated circuit device comprising one or more interconnects. Each interconnect of the one or more interconnects can be structured as a stack of layers including distinct topological layers, where each of the...