ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,136, issued on Nov. 18, was assigned to International Business Machines Corp. (Armonk, N.Y.).
"Liner-less via contact" was invented by Ruilong Xie (Niskayuna, N.Y.), Julien Frougier (Albany, N.Y.), Nicolas Loubet (Guilderland, N.Y.), Kangguo Cheng (Schenectady, N.Y.) and Chanro Park (Clifton Park, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnect structure and a method of forming the interconnect structure are provided. The interconnect structure includes a source drain contact above and contacting a source drain region of a semiconductor device. The interconnect structure also includes a via above and contacting the source drain c...