US Patent Issued to International Business Machines on Aug. 26 for "Dual-damascene fav interconnects with dielectric plug" (Chinese, American Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,912, issued on Aug. 26, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Dual-damascene fav interconnects with dielectric plug" was invented by Chanro Park (Clifton Park, N.Y.), Kenneth Chun Kuen Cheng (Shatin, Hong Kong), Koichi Motoyama (Clifton Park, N.Y.) and Chih-Chao Yang (Glenmont, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The structure comprises a first low-k dielectric layer on top of a substrate. The structure comprises one or more trenches within the first low-k dielectric layer. The structure comprises a first barrier layer on the first low-k dielectric layer, a first liner layer on top of the first barrie...