US Patent Issued to Intel on Oct. 7 for "Undercut design with a bonded base cover for friendly assembly and effective thermal tuning of micro-ring resonator (MRR) in open cavity photonic integrated chips (OCPIC)" (Arizona, California Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,436,413, issued on Oct. 7, was assigned to Intel Corp. (Santa Clara, Calif.).

"Undercut design with a bonded base cover for friendly assembly and effective thermal tuning of micro-ring resonator (MRR) in open cavity photonic integrated chips (OCPIC)" was invented by Chia-Pin Chiu (Tempe, Ariz.), Kaveh Hosseini (Livermore, Calif.), Omkar Karhade (Chandler, Ariz.) and Tim Tri Hoang (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include optoelectronic systems and methods of forming such systems. In an embodiment, an optoelectronic system comprises a first substrate, a second substrate over the first substrate, ...