US Patent Issued to Intel on Oct. 14 for "Temperature sensor to achieve thermal stabilization of micro-ring resonator (MRR) in an open cavity photonic integrated circuit (OCPIC)" (Arizona, California Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,442,982, issued on Oct. 14, was assigned to Intel Corp. (Santa Clara, Calif.).

"Temperature sensor to achieve thermal stabilization of micro-ring resonator (MRR) in an open cavity photonic integrated circuit (OCPIC)" was invented by Chia-Pin Chiu (Tempe, Ariz.), Kaveh Hosseini (Livermore, Calif.), Omkar Karhade (Chandler, Ariz.) and Tim Tri Hoang (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include an optoelectronic system. In an embodiment, the optoelectronic system comprises a first substrate, a second substrate over the first substrate, and a micro-ring resonator (MRR) over the second substrate. In an ...