US Patent Issued to INSTITUTE OF SCIENCE TOKYO, KANAWA INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY, CANON KABISHIKI on Nov. 25 for "Resin composition and resin molded body thereof" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,972, issued on Nov. 25, was assigned to INSTITUTE OF SCIENCE TOKYO (Tokyo), KANAWA INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY (Ebina, Japan) and CANON KABISHIKI KAISHA (Tokyo).

"Resin composition and resin molded body thereof" was invented by Masaki Azuma (Tokyo), Yuki Sakai (Kanagawa, Japan) and Takahiro Kojima (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention aims to obtain a resin composition with low thermal expansion property by suppressing functional deterioration in negative thermal expansion property when a negative thermal expansion material is added to a thermoplastic resin and heat-processed. The pr...