US Patent Issued to IBIDEN on Jan. 20 for "Printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,413, issued on Jan. 20, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).

"Printed wiring board" was invented by Susumu Kagohashi (Ogaki, Japan), Jun Sakai (Ogaki, Japan) and Kyohei Yoshikawa (Ogaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed wiring board includes a first conductor layer, a resin insulating layer laminated on the first conductor layer and including resin material and inorganic particles, a second conductor layer formed on a first surface of the insulating layer such that the first conductor layer is facing a second surface of the insulating layer, and a via conductor formed in an opening extending through the insul...