US Patent Issued to HYUNDAI MOTOR, KIA on March 25 for "Ejecting apparatus of injection molding mold" (South Korean Inventor)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,257,753, issued on March 25, was assigned to HYUNDAI MOTOR COMPANY (Seoul, South Korea) and KIA Corp. (Seoul, South Korea).

"Ejecting apparatus of injection molding mold" was invented by Weonseok Yang (Busan, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An ejecting apparatus of an injection molding mold, including an ejecting plate on a lower die of the injection molding mold, the ejecting plate configured to be movable in a vertical direction, at least one main ejecting block coupled to a fixed core on the lower die, the at least one main ejecting block configured to be movable in the vertical direction and connected to the ejecting plat...