US Patent Issued to HL KLEMOVE, HL MANDO on Jan. 20 for "Heat dissipation structure of printed circuit board, manufacturing methods thereof, and heat dissipation system for electronic device" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,404, issued on Jan. 20, was assigned to HL KLEMOVE CORP. (Incheon, South Korea) and HL MANDO Corp. (Pyeongtaek -si, South Korea).

"Heat dissipation structure of printed circuit board, manufacturing methods thereof, and heat dissipation system for electronic device" was invented by Jihoon Han (Incheon, South Korea), Sanghyun Jin (Incheon, South Korea), Minha Lee (Incheon, South Korea), Kunju Koh (Incheon, South Korea) and Seungcho Han (Namyangju-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation structure of a printed circuit board in which a heating element is disposed on one surface thereof and a heat sink is disposed...