US Patent Issued to Henkel on Feb. 25 for "Thermal management of high heat flux multicomponent assembly" (California, Minnesota Inventors)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,238,899, issued on Feb. 25, was assigned to Henkel AG & Co. KGaA (Duesseldorf, Germany).

"Thermal management of high heat flux multicomponent assembly" was invented by Radesh Jewram (Lakeville, Minn.) and Yuan Zhao (Tustin, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package includes a thermal interface for dissipating heat from an electronic component array including a plurality of electronic components secured to a substrate. The thermal interface includes a thin heat spreading layer for transferring heat input from the electronic components along directions transverse to heat flux. The heat spreading layer is part of a laminat...