US Patent Issued to HANGZHOU ZHONGWEI PHOTOELECTRONIC TECHNOLOGY on July 29 for "Turnaround mechanism of silicon wafers" (Chinese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,566, issued on July 29, was assigned to HANGZHOU ZHONGWEI PHOTOELECTRONIC TECHNOLOGY Co. LTD. (Hangzhou, China).

"Turnaround mechanism of silicon wafers" was invented by Hong Li (Hangzhou, China), Jiangshui Zhang (Hangzhou, China), Jian Jing (Hangzhou, China), Jun Wang (Hangzhou, China), Guangquan Zhang (Hangzhou, China), You Huang (Hangzhou, China), Zhe Liu (Hangzhou, China), Yongjian Fang (Hangzhou, China), Pucha Hu (Hangzhou, China) and Xiaoying Zhu (Hangzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A turnaround mechanism of silicon wafers is provided. The turnaround mechanism includes a material frame, a supporting component, a seco...