US Patent Issued to Globalwafers on Sept. 23 for "Wafer boats for supporting semiconductor wafers in a furnace" (Missouri, Illinois Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,471, issued on Sept. 23, was assigned to Globalwafers Co. Ltd. (Hsinchu, Taiwan).

"Wafer boats for supporting semiconductor wafers in a furnace" was invented by Sumeet S. Bhagavat (St. Charles, Mo.) and Qingmin Liu (Glen Carbon, Ill.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer boat for supporting a plurality of semiconductor wafers in a furnace is disclosed. The wafer boat includes a set of fingers each having a contact protuberance which contacts and supports a semiconducting wafer. The contact protuberances may be arranged in a rotationally symmetric pattern about the wafer boat."

The patent was filed on May 17, 2024, under Applicatio...