US Patent Issued to FUKUDA METAL FOIL & POWDER, TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING on July 15 for "Laminating and shaping copper powder, laminated and shaped object, manufacturing method of laminated and shaped object, and laminating and shaping apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,358,076, issued on July 15, was assigned to FUKUDA METAL FOIL & POWDER Co. LTD. (Kyoto, Japan) and TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING (Tokyo).

"Laminating and shaping copper powder, laminated and shaped object, manufacturing method of laminated and shaped object, and laminating and shaping apparatus" was invented by Yuji Sugitani (Kyoto, Japan) and Hideki Kyogoku (Hiroshima, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a laminating and shaping copper powder capable of shaping a laminated and shaped object of copper having a high electrical conductivity of, for example, 80% IACS or mor...