US Patent Issued to FUJIFILM on Sept. 23 for "Method of manufacturing cured film, photocurable resin composition, method of manufacturing laminate, and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,422,750, issued on Sept. 23, was assigned to FUJIFILM Corp. (Tokyo).

"Method of manufacturing cured film, photocurable resin composition, method of manufacturing laminate, and method of manufacturing semiconductor device" was invented by Kazuomi Inoue (Shizuoka, Japan), Yuichiro Enomoto (Shizuoka, Japan) and Kazuto Shimada (Shizuoka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There are provided a method of manufacturing a cured film, including a first exposure step of exposing a part of a photocurable film formed from a photocurable resin composition, a development step of developing the photocurable film after the exposure with a developing ...