US Patent Issued to Enpulse on Oct. 28 for "Adhesive film for polishing pad, laminated polishing pad including the same and method of polishing wafer" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,454,636, issued on Oct. 28, was assigned to Enpulse Co. Ltd. (Cheonan-si, South Korea).

"Adhesive film for polishing pad, laminated polishing pad including the same and method of polishing wafer" was invented by Jung Nam Lee (Seoul, South Korea), Sunghoon Yun (Seoul, South Korea) and Jangwon Seo (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An adhesive film for a polishing pad including a plurality of through holes extended from a top surface to a bottom surface of the adhesive film, wherein a volume fraction of the plurality of through holes is 3% to 20% based on a total volume of the adhesive film, is disclosed."

The patent was f...