US Patent Issued to Enpulse on Nov. 25 for "Polishing pad, method for manufacturing polishing pad, and polishing method applying polishing pad" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,063, issued on Nov. 25, was assigned to Enpulse Co. Ltd. (Cheonan-si, South Korea).

"Polishing pad, method for manufacturing polishing pad, and polishing method applying polishing pad" was invented by Jaein Ahn (Seongnam-si, South Korea), Jang Won Seo (Suwon-si, South Korea), Jong Wook Yun (Suwon-si, South Korea), Sunghoon Yun (Seongnam-si, South Korea), Hye Young Heo (Yongin-si, South Korea) and Su Young Moon (Anyang-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing pad includes a polyurethane, wherein the polyurethane includes in its main chain a silane repeating unit represented by Formula 1, wherein the number of defects...