US Patent Issued to EBARA on Jan. 28 for "Coupling mechanism with spherical bearing, method of determining bearing radius of spherical bearing, and substrate polishing apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,208,488, issued on Jan. 28, was assigned to EBARA Corp. (Tokyo).

"Coupling mechanism with spherical bearing, method of determining bearing radius of spherical bearing, and substrate polishing apparatus" was invented by Hiroyuki Shinozaki (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A coupling mechanism capable of preventing vibration of a rotating body from occurring due to a lower-bearing friction torque is disclosed. The coupling mechanism includes an upper spherical bearing and a lower spherical bearing disposed between a drive shaft and a rotating body. The upper spherical bearing has a first concave contact surface and a second convex cont...