ALEXANDRIA, Va., March 12 -- United States Patent no. 12,247,125, issued on March 11, was assigned to DuPont Toray Specialty Materials K.K. (Tokyo) and DuPont Specialty Materials Korea Ltd. (Chungcheongnam-Do, South Korea).
"Curable silicone composition, encapsulant and optical semiconductor device" was invented by Sawako Horie (Chiba, Japan), Shunya Takeuchi (Chiba, Japan), Akihiko Kobayashi (Chiba, Japan), Misoon Jung (Gyeonggi-do, South Korea) and Hyunji Kang (Gyeonggi-do, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A curable silicone composition comprises (A) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and at least one (SiO4/2) ...