US Patent Issued to DUPONT ELECTRONIC MATERIALS INTERNATIONAL, DDP SPECIALTY PRODUCTS TAIWAN on Dec. 30 for "Metallization method" (Japanese, Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,430, issued on Dec. 30, was assigned to DUPONT ELECTRONIC MATERIALS INTERNATIONAL LLC (Marlborough, Mass.) and DDP SPECIALTY PRODUCTS TAIWAN Co. LTD. (Taipei, Taiwan).

"Metallization method" was invented by Mitsuru Haga (Niigata, Japan) and Ching-Lung Chen (Miaoli, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein is a metallization method, comprising (a) forming on a first surface of a substrate an underlayer from an underlayer composition comprising: a first polymer comprising an acid-labile group, and a sensitizing group, wherein (i) the first polymer comprises the sensitizing group or (ii) a compound that is distinct from th...