US Patent Issued to DONG-A UNIVERSITY RESEARCH FOUNDATION FOR INDUSTRY-ACADEMY COOPERATION on July 8 for "Electrodeposition apparatus to prepare a multilayer copper foil" (South Korean Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,351,928, issued on July 8, was assigned to DONG-A UNIVERSITY RESEARCH FOUNDATION FOR INDUSTRY-ACADEMY COOPERATION (Busan, South Korea).

"Electrodeposition apparatus to prepare a multilayer copper foil" was invented by Hyo Jong Lee (Busan, South Korea), Han Kyun Shin (Changwon-si, South Korea) and Sang Hyeok Kim (Busan, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The multilayer copper foil includes: a recrystallization active layer disposed on a surface of a substrate; and a recrystallization suppressing layer disposed on a surface of the recrystallization active layer to inhibit recrystallization of the recrystallization active layer, wher...