US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies, National University Corporation Tokai National Higher Education and Research System, HAMMATSU PHOTONICS on May 6 for "Semiconductor chip and method for manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,945, issued on May 6, was assigned to DENSO Corp. (Kariya, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan), MIRISE Technologies Corp. (Nisshin, Japan), National University Corporation Tokai National Higher Education and Research System (Nagoya, Japan) and HAMMATSU PHOTONICS K.K. (Hamamatsu, Japan).

"Semiconductor chip and method for manufacturing the same" was invented by Shinichi Hoshi (Nisshin, Japan), Masatake Nagaya (Nisshin, Japan), Chiaki Sasaoka (Nagoya, Japan), Daisuke Kawaguchi (Hamamatsu, Japan) and Keisuke Hara (Hamamatsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor chip includes a chip constituent substrate having a ...